“Butterfly” packages are widely used in telecom applications. A butterfly package design has been the historical choice for DWDM applications. The internal space makes it able to fit TEC with dimensions up to 7.0x15.0mm2 and cooling power up to 12W. RMT advises TE solutions on ML TEC Series, specially optimized to fit into “Butterfly” packages.
“Butterfly” 14pin Header
TE Cooler
TEC Pads for WB
(or wire solution)
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A.Header Material
Base - Kovar, CuW
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B.Header Surface Finish
Gold Plating
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C.TEC Mounting
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1. Soldering
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a.Solder 138, Sn-Bi, Tmelt=138ºC
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b.Solder 199, Sn-Zn, Tmelt=199ºC
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3. Epoxy Gluing
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D.TEC Leads Connections
Soldering Sn-Sb, Tmelt=230ºC
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E.TEC Cold Side Finish
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1.Blank Ceramics
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2.Metallized Ceramics
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a.Ni/Sn plating
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b.Au plating
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3.Metallized and Pre-tinned
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a.Solder 117, In-Sn, Tmelt=117ºC
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b.Solder 138, Sn-Bi, Tmelt=138ºC
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F.Thermistor (Optional)
RMT’s TB type NTC thermistor
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1.10kOhm@20C, 5%
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2.2.2kOhm@20C, 5%
Individual calibration available
Mounting by Epoxy Gluing
“Butterfly” 14pin
glass-to-metal, type C1
Thermistor
TEC to Header
Mounting (Soldering)
Thermistor to Header Pins Mounting (Soldering)
“Butterfly” 14pin
ceramics-to-metal, type C1
Dimensions are in millimeters
Click here to explore all available sub-mounts with detailed datasheets
“Butterfly” 14pin
ceramics-to-metal, type C2
© TEC Microsystems GmbH 2008
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‣The package is specialized for Telecom applications.
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‣The base material can be various: Kovar, CRS, CuW, CuMo.
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‣The number of pins is usually 7 (one-side) or 14 (double-side).
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‣The pinouts can be glass-sealed or ceramics.
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‣Solutions with powerful single-stage TE modules are possible.
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‣The sub-mount base thermal resistance is relatively small.
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‣Strong reliability according to Telcordia GR-468 is required.
