New thermoelectric TO-8 and TO-66 Sub-Assemblies types are available. The standard range of TO-8 and TO-66 Sub-Assemblies is expanded with new TECs from MD Series, single- and multistage types. MD Series high-density pellets conception provides more pellets on the same size or more compact TECs with the same number of pellets as regular types. This means the availability of more powerful TECs for TO-8 or TO-66 Headers applications, or a possibility to apply TECs that were not able to fit on TO-8 or TO-66 headers previously ( for example it is possible now to mount 4-stage TEC onto typical TO-8 header). MD TECs solutions expand the thermoelectric cooling possibilities for applications where TO-8 and TO-66 headers are typically used:
November 12, 2008
TO-8 and TO-66 TE sub-Assemblies update
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• DFB Laser Diodes
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• Quantum Cascade Lasers
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• Superluminescent Diodes
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• X-Ray Detectors
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• Infra-Red Detectors
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• Avalanche Photodiodes
The installing of MD 4-stage TEC instead of typical 3-stage. dTmax increasing is more than 10% at the same Qmax
MDX 2-stage TEC gives 2 times more cooling power and enlarged top ceramics size at the same current and voltage requirements
Using of MD 2-stage TEC increases cooling power almost three times more with almost the same sizes
+ 10% dTmax
x2 Qmax
x2 Qmax
Standard
MD TEC
Standard
MD TEC
Standard
MD TEC
The range of new thermoelectric MD TEC Sub-Assemblies with performance parameters are specified below. Please, select datasheet picture to download the complete datasheet with a drawing and performance plots.
TO-66 9pin Sub-Assemblies with MD TECs
TO-8 12 pin Sub-Assemblies with MD TECs
