TEC Microsystems introduces new option available for Thermoelectric Sub-Assemblies. Headers and Packages with mounted thermoelectric coolers now can be marked with laser marking. It simplifies quality control, stock operation and identification process on customer side.

Headers can be marked with various identification numbers upon customer request or (and) additional symbols - for instance thermoelectric cooler polarity, thermistor pins or package ground pin.

Such labeling is useful for example with Sub-Assemblies on TO-style packages like TO-8 or TO-3, where TEC pins or ground pins can be not so easy to indicate after final packaging, when a cap is mounted.