TEC "Heavy duty" - Thermoelectric Cooler for high-power fiber coupled pump lasers
TEC Microsystems GmbH and RMT introduce new thermoelectric cooler for high-power fiber coupled pump lasers. A new 1MD10-037-08 TE cooler is developed for industrial standard “Butterfly” type packages. This TE cooler is the “heavy duty” type for applications with high heat load. It provides an effective temperature stabilization and up to 70% reduced power consumption for high-power pump lasers comparing with standard TE coolers.
August 18, 2010
Fig.1 - 1MD10-037-08 dimensions (in mm)
High-power fiber coupled pump lasers required for harsh environments in telecom, industrial and defense applications. Fiber telecoms, fiber lasers, fiber amplifiers, fiber optic sensing and free space communications devices require pump lasers with a high output power. Standard thermoelectric coolers that fit in Butterfly packages, may be not suitable when total heatload is higher than 3W.
The following table shows the example of operating parameters for the typical telecom thermoelectric coolers and the new “heavy duty” type 1MD10-037-08.
At the typical +55C ambient temperature new “heavy duty” TE cooler can pump up to 8W of heat, having up to 70% less power consumption.
1MD10-037-08 TEC provides a required temperature stabilization under conditions where standard thermoelectrical coolers are not suitable. The most effective operating is in 3-6W heatload range. The power consumption of 1MD10-037-08 in this heatload range is up to 70% less comparing with standard TE coolers.
Such a performance is a result of optimized thermoelectric cooler design. RMT high density pellets placement technology is supplemented with the increased cross-section of BiTe elements inside a thermoelectric cooler. Both the innovations give the required performance under harsh environments, providing the optimal power consumption in operating mode.
Fig.2 - 1MD10-037-08 TE Cooler
Fig.3 - Standard (left) and 1MD10-037-08 TE Cooler interior (top ceramics removed)
The new thermoelectric cooler is available with different ceramics surface options. The TEC can be manufactured with blank, Au plated or pre-tinned ceramics for further mounting. Customized Au patterns on the cold side are available.
1MD10-037-08 complete datasheet is available by this link. TEC Microsystems GmbH provides also mounting of thermoelectric coolers into Customer’s packages.
