Company news

On-Line Search updated

Thu, 15 Mar 2012 09:08:35 +0100

New On-Line Assistant is available with more search functionality. On-Line Assistant provides a fast and flexible parametric search among all standard thermoelectric coolers nomenclature, provided by TEC Microsystems GmbH company. On-Line Assistant allows to find the required thermoelectric cooler by specifying key parameters - dimensions and/or performance. It has an optimized algorithm to find the most optimal thermoelectric module that matches specified key parameters and provides a link to detailed thermoelectric cooler datasheet.

New Interactive Catalog is available

Fri, 25 Nov 2011 13:40:18 +0100

New offline interactive catalog is available. The complete standard nomenclature of thermoelectric coolers is available in electronic format with an interactive search function. All thermoelectric coolers in the catalog are provided with detailed performance info and datasheet. The parametric search allows to find the optimal thermoelectric cooler fast without internet connection. The detailed analysis of selected thermoelectric cooler can be made using TECCad software, provided together with the catalog. Additionally new catalog is equipped with technical manuals and applications tips for thermoelectric coolers handling and mounting. The catalog is available for download by direct request only.

Cool Aperture - new center-hole thermoelectric coolers

Wed, 8 Jun 2011 15:29:24 +0200

TEC Microsystems GmbH and RMT Ltd introduce new types of center-hole thermoelectric coolers, optimized for LD applications with TO-56 or 9mm industrial standard headers. New thermoelectric coolers with dimensions of 6.6x6.6mm and 8.0x8.0mm have five different height and performance options each. Additional high-performance versions are available.

Telcordia GR-468 Qualification - Reliability Report 2010 is available

Wed, 6 Apr 2011 12:13:45 +0200

TEC Microsystems GmbH and RMT have successfully completed the latest reliability testing report for thermoelectric coolers. The complete reliability testing of thermoelectric coolers from standard manufacturing range took more than half a year in 2010. Such qualification is made by RMT every two years on a regular base. The latest reliability report for 2010 is available by request.

Bulk and tiny - world smallest bulk technology thermoelectric cooler

Mon, 6 Dec 2010 14:04:56 +0100

TEC Microsystems GmbH and RMT introduce world smallest thermoelectric cooler manufactured by bulk technology. New type belongs to recently developed 1MD03 Series of high-efficient thermoelectric coolers with low-power consumption. With just 1.6x1.0mm footprint new 1MD03-002-xx TEC is suitable for integrating in absolute miniature constructions. It is possible now to mount it on typical TO-56 header, which is originally used for non-cooled solutions.

Going more TOSA - new low-power consumption thermoelectric coolers for TOSA

Wed, 8 Sep 2010 13:08:20 +0200

TEC Microsystems GmbH introduces a new line of miniature thermoelectric coolers designed specially as a low-current solution for cooled TOSA applications. This new product line supplements previously developed range of miniature 1MD04 thermoelectric coolers for the cooled TOSA MSA. Thermoelectric coolers of the new 1MD03 Series have the same dimensions but a revised inner design that reduces the operating current twice and keeps TEC height less than 1.0mm. The new thermoelectric coolers target high performance TOSA components for XFP and SFP+ transceivers with low power consumption requirements.

TEC "Heavy duty" - Thermoelectric Cooler for high-power fiber coupled pump lasers

Wed, 18 Aug 2010 11:14:59 +0200

TEC Microsystems GmbH and RMT introduce new thermoelectric cooler for high-power fiber coupled pump lasers. A new 1MD10-037-08 TE cooler is developed for industrial standard “Butterfly” type packages. This TE cooler is the “heavy duty” type for applications with high heat load. It provides an effective temperature stabilization and up to 70% reduced power consumption for high-power pump lasers comparing with standard TE coolers.

MicroTECs for extra space - thermoelectric coolers on special thin ceramics

Thu, 15 Jul 2010 16:12:43 +0200

TEC Microsystems and RMT introduce special solution for applications with micro thermoelectric coolers. Miniature thermoelectric coolers with only 0.6mm height are available. This special ultra-thin solution is developed for LD applications with limited packaging space. The lowest height of typical thermoelectric coolers is around 0.9mm. But laser diodes on TO-46 headers or TO-style TOSA have very limited space for integrating of TE cooler. Even additional 100-200 microns of space may be critical for components packaging. With special thin ceramics TEC Microsystems provides now up to 300um of extra space for mounting, keeping TEC height at 0.6mm only.

Out of pyramids - new 3-stage thermoelectric cooler types

Wed, 16 Jun 2010 17:03:13 +0200

TEC Microsystems and RMT introduce new range of miniature 3-stage thermoelectric coolers - 3MDC types with specially enlarged cold side area. 3MDC coolers combine standard and HD pellets placement technologies. The dimensions of 3MDC coolers top and bottom ceramics plates are the same. This is optimal for detectors, creating of TE cooler arrays, TEC packaging and handling. New 3MDC TECs have up to 60% higher cooling capacity, comparing with typical solutions of the same size available on the market.

Hi-TEC - High Performance Thermoelectric Coolers for High Heat Load applications

Thu, 11 Mar 2010 10:26:23 +0100

TEC Microsystems GmbH introduces thermoelectric coolers, optimized for high-power LD applications in HHL form-factor. High-performance thermoelectric coolers of MC06 and MX06 Series with cooling capacity starting from 28W and higher provide significantly better cooling performance than any standard solutions available on the market.

New Thermoelectric Catalog 2010 is available

Fri, 22 Jan 2010 13:49:09 +0100

New catalogue 2010 of RMT thermoelectric products is available for downloading. Detailed documentation on RMT thermoelectric products is presented:

•    Thermoelectric cooling modules
•    Thermoelectric Sub-Assemblies
•    Temperature Controllers
•    Z-Meters TEC Measuring Devices
•    TECCad Modeling Software

Single step to Multistage - the simple way to increase cooling level in detector applications

Fri, 8 Jan 2010 18:53:58 +0100

TEC Microsystems GmbH introduces 2-stage thermoelectric cooler designed for simple substitution of standard single-stage 8x8mm TE coolers in various detector applications to archive higher cooling level. 8x8mm thermoelectric cooler on TO-8 style header is the one of typical solutions for X-Ray detectors and some IR sensing applications. In many cases a single-stage TEC provides enough cooling level for IR or X-Ray detector. However, the trend for signal resolution increasing and noise reducing may require lower operating temperatures, where two-stage TE cooler is more optimal.

Participating in Photonics West 2010 and OFC 2010 trade fairs

Wed, 4 Nov 2009 19:57:17 +0100

TEC Microsystems GmbH participates in Photonics West’10 and OFC’10 exhibitions in 2010. Welcome to visit our Booth # 4601 on January 26-28, San Francisco, The Moscone Center, German Pavilion during Photonics West 2010. The whole range of Thermoelectric Modules and Sub-Assemblies will be introduced together with latest developments.
On March 23-25, please, visit our booth # 1214 in San Diego, San Diego Convention Center, German Pavilion. We will exhibit our thermoelectric cooling solutions for telecoms applications, including cooled TOSA solutions and HD technology TE coolers with up to 100% increased cooling capacity.

4-stage Cooling for Photodetector applications - new solution on standard TO-8 headers

Fri, 25 Sep 2009 20:18:47 +0200

TEC Microsystems GmbH introduces two special Thermoelectric Cooling sub-assemblies on standard TO-8 headers for HgCdTe Photodetector Applications. The existing single solution on TO-8 headers with 4MD04-116-xx type is supplemented with new thermoelectric cooler type - 4MD04-160-xx TEC. Based on RMT HD technology 4MD04-160-xx TE cooler has the increased cooling capacity and unique size, sufficiently compact to fit on standard TO-8 headers. New thermoelectric sub-assembly provides up to 125 degree of maximum temperature difference and up to 0.8W cooling capacity. Both 4-stage thermoelectric cooling sub-assemblies are oriented mainly for Mercury Cadmium Telluride photodetectors and some other applications where operating at temperatures below 200K is required.

Z-Meters - Universal Solution for Thermoelectric Coolers Measurements and Quality Control

Tue, 11 Aug 2009 10:06:21 +0200

Thermoelectric (Peltier) Coolers (TECs) are the important part of a range of optoelectronic applications. Semiconductor lasers, DPSS lasers, Superluminescent diodes, Infrared and X-Ray detectors, Photon Counters, CCD and CMOS Imagers, DNA cyclers, Medical Calorimeters and many other products require built-in miniature TECs for thermal management. Telecom industry utilizes thermoelectrically cooled LD in Butterfly or TOSA packages as standard and consumes different types of miniature Peltier elements in great volumes. Many types of Infrared and X-Ray detectors provide best performance with thermoelectric cooling only. CCD matrixes, FPA and CMOS sensors demonstrate considerable sensitivity increase if thermoelectric cooling is applied. Large number of state-of-art laser and other optoelectronic devices has thermoelectric cooler as a standard element of design.

Black Body Task - New Range of Thermoelectric Thermal Reference Source (TTRS) Products

Wed, 22 Jul 2009 10:44:40 +0200

TEC Microsystems introduces new range of Thermoelectric Thermal Reference Source (TTRS) products based on TO-8, TO-3 and TO-822 headers. Thermoelectric Thermal Reference Source (TTRS) sub-assemblies provide a temperature-controllable, uniform-temperature, high-emissivity surface that is used in calibrating of infrared (IR) detector arrays and FLIR systems. When viewed by the FLIR system detectors, the TTRS enables the system electronics to perform gain and offset calibration as well as DC restoration for each pixel's preamp.

Power to Butterfly - New Series of Miniature Thermoelectric Coolers with increased Cooling Capacity

Tue, 7 Jul 2009 13:41:24 +0200

Modern applications in optical fibercom industry require more heat power to dissipate. Various High Power Tunable Lasers need a significant amount of heat to be dissipated for optimal performance and stable wavelength. Sometimes typical telecom TECs of 23, 29, 35 couples in de-facto standard Butterfly packages are not suitable for temperature stabilization in high power applications. Developers and manufacturers have to switch for larger and more powerful TECs, but such types require more space and don't fit in standard Butterfly package. In this case the typical solution is using of HHL headers with integrated thermoelectric cooling, however such solution in most cases is significantly more expensive than Butterfly.

Split and Concat - Elongated Thermoelectric Cooling Solutions

Thu, 14 May 2009 09:10:59 +0200

In a certain amount of applications a thermoelectric (Peltier) cooler with elongated shape is required. For instance, DPSS (Diode Pumped Solid State Lasers) may need TEC with rectangular shape to fit pump module and a holder with crystal, and some of them may need more space than typical telecom TEC dimensions can provide. Or another example - thermoelectric cooling for some CCD matrixes with long planar shape, like 10x110mm2 or so.

Laser Marking Service for Thermoelectric Sub-Assemblies is available now

Tue, 12 May 2009 11:08:58 +0200

TEC Microsystems introduces new option available for Thermoelectric Sub-Assemblies. Headers and Packages with mounted thermoelectric coolers now can be marked with laser marking. It simplifies quality control, stock operation and identification process on customer side.
Headers can be marked with various identification numbers upon customer request or (and) additional symbols - for instance thermoelectric cooler polarity, thermistor pins or package ground pin.
Such labeling is useful for example with Sub-Assemblies on TO-style packages like TO-8 or TO-3, where TEC pins or ground pins can be not so easy to indicate after final packaging, when a cap is mounted.

Participating in Laser 2009 trade fair in Munich

Fri, 17 Apr 2009 12:28:23 +0200

TEC Microsystems GmbH participates in Laser 2009 Exhibition in Munich. Welcome to visit our Booth # 462 on June 15-18, Hall B1. Together with RMT Ltd we will introduce the whole range of Thermoelectric Modules and Sub-Assemblies , Temperature Controllers and Measuring devices for thermoelectric coolers.