<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:iweb="http://www.apple.com/iweb" version="2.0">
  <channel>
    <title>Company news</title>
    <link>http://www.tec-microsystems.com/EN/Blog_news/Blog_news.html</link>
    <description>TEC Microsystems GmbH is fast growing company with a lot of new ideas, successfully released projects and current development processes. Our main focus is on miniature thermoelectric coolers and solutions for laser and optoelectronics devices. &lt;br/&gt;We’re glad to share with information about our new products, latest developments, ideas and useful advises in thermoelectric cooling applications. This news section is being published as a blog with RSS feed subscription. We will be very glad if such a solution will be useful for you. Please, subscribe for news channel and stay connected.</description>
    <generator>iWeb 3.0.1</generator>
    <image>
      <url>http://www.tec-microsystems.com/EN/Blog_news/Blog_news_files/GD187.jpg</url>
      <title>Company news</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Blog_news.html</link>
    </image>
    <item>
      <title>TEC &quot;Heavy duty&quot; - Thermoelectric Cooler for high-power fiber coupled pump lasers</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/8/18_%22Heavy_duty%22_-_Thermoelectric_Cooler_for_high-power_fiber_coupled_pump_lasers.html</link>
      <guid isPermaLink="false">6948540b-cfc7-4da3-99d2-811def00f118</guid>
      <pubDate>Wed, 18 Aug 2010 11:14:59 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/8/18_%22Heavy_duty%22_-_Thermoelectric_Cooler_for_high-power_fiber_coupled_pump_lasers_files/BTF14.1MD1003708_2.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object041_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH and RMT introduce new thermoelectric cooler for high-power fiber coupled pump lasers. A new 1MD10-037-08 TE cooler is developed for industrial standard “Butterfly” type packages.  This TE cooler is the “heavy duty” type for applications with high heat load. It provides an effective temperature stabilization and up to 70% reduced power consumption for high-power pump lasers comparing with standard TE coolers.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/8/18_%22Heavy_duty%22_-_Thermoelectric_Cooler_for_high-power_fiber_coupled_pump_lasers_files/BTF14.1MD1003708_2.jpg" length="55130" type="image/jpeg"/>
    </item>
    <item>
      <title>MicroTECs for extra space - thermoelectric coolers on special thin ceramics</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/7/15_MicroTECs_with_extra_space_-_thermoelectric_coolers_on_special_thin_ceramics.html</link>
      <guid isPermaLink="false">c888a482-b6fe-46a4-9bfa-69063148b835</guid>
      <pubDate>Thu, 15 Jul 2010 16:12:43 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/7/15_MicroTECs_with_extra_space_-_thermoelectric_coolers_on_special_thin_ceramics_files/Thin_Thermoelectric_Cooler2s.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object001_2.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems and RMT introduce special solution for applications with micro thermoelectric coolers. Miniature thermoelectric coolers with only 0.6mm height are available. This special ultra-thin solution is developed for LD applications with limited packaging space. The lowest height of typical thermoelectric coolers is around 0.9mm.  But laser diodes on TO-46 headers or TO-style TOSA have very limited space for integrating of TE cooler. Even additional 100-200 microns of space may be critical for components packaging. With special thin ceramics TEC Microsystems provides now up to 300um of extra space for mounting, keeping TEC height at 0.6mm only.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/7/15_MicroTECs_with_extra_space_-_thermoelectric_coolers_on_special_thin_ceramics_files/Thin_Thermoelectric_Cooler2s.jpg" length="68699" type="image/jpeg"/>
    </item>
    <item>
      <title>Out of pyramids - new 3-stage thermoelectric cooler types</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/6/16_Out_of_pyramide_-_new_3-stage_thermoelectric_cooler_types.html</link>
      <guid isPermaLink="false">0e5ab359-2175-42c7-83bc-dbb4d7d3eb45</guid>
      <pubDate>Wed, 16 Jun 2010 17:03:13 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/6/16_Out_of_pyramide_-_new_3-stage_thermoelectric_cooler_types_files/TO-8_3MDC04-113-xx_blue_cell.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object000_3.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems and RMT introduce new range of miniature 3-stage thermoelectric coolers - 3MDC types with specially enlarged cold side area. 3MDC coolers combine standard and HD pellets placement technologies. The dimensions of 3MDC coolers top and bottom ceramics plates are the same. This is optimal for detectors, creating of TE cooler arrays, TEC packaging and handling.  New 3MDC TECs have up to 60% higher cooling capacity, comparing with typical solutions of the same size available on the market.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/6/16_Out_of_pyramide_-_new_3-stage_thermoelectric_cooler_types_files/TO-8_3MDC04-113-xx_blue_cell.jpg" length="80103" type="image/jpeg"/>
    </item>
    <item>
      <title>Hi-TEC - High Performance Thermoelectric Coolers for High Heat Load applications</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/3/11_HHL_Hi-TEC_-_High_Performance_Thermoelectric_Coolers_for_HHL_applications.html</link>
      <guid isPermaLink="false">365e799a-fc3e-4c95-8ff9-3e21f88e4ec7</guid>
      <pubDate>Thu, 11 Mar 2010 10:26:23 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/3/11_HHL_Hi-TEC_-_High_Performance_Thermoelectric_Coolers_for_HHL_applications_files/HHL_Asm.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object000_4.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH introduces thermoelectric coolers, optimized for high-power LD applications in HHL form-factor. High-performance thermoelectric coolers of MC06 and MX06 Series with cooling capacity starting from 28W and higher provide significantly better cooling performance than any standard solutions available on the market. </description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/3/11_HHL_Hi-TEC_-_High_Performance_Thermoelectric_Coolers_for_HHL_applications_files/HHL_Asm.jpg" length="61332" type="image/jpeg"/>
    </item>
    <item>
      <title>New Thermoelectric Catalog 2010 is available</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/22_New_Thermoelectric_Catalog_2010_is_available.html</link>
      <guid isPermaLink="false">9d1d7fe2-bc39-4ec2-b535-40bc120ebb44</guid>
      <pubDate>Fri, 22 Jan 2010 13:49:09 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/22_New_Thermoelectric_Catalog_2010_is_available_files/TEC2010_Cover.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object054_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:258px;&quot;/&gt;&lt;/a&gt;New catalogue 2010 of RMT thermoelectric products  is available for downloading. Detailed documentation on RMT thermoelectric products is presented:&lt;br/&gt;&lt;br/&gt;	•	   Thermoelectric cooling modules&lt;br/&gt;	•	   Thermoelectric Sub-Assemblies&lt;br/&gt;	•	   Temperature Controllers&lt;br/&gt;	•	   Z-Meters TEC Measuring Devices&lt;br/&gt;	•	   TECCad Modeling Software &lt;br/&gt;&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/22_New_Thermoelectric_Catalog_2010_is_available_files/TEC2010_Cover.jpg" length="130904" type="image/jpeg"/>
    </item>
    <item>
      <title>Single step to Multistage - the simple way to increase cooling level in detector applications</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/8_Single_step_to_Multistage_-_the_way_to_increase_cooling_level_in_detector_applications.html</link>
      <guid isPermaLink="false">0e3d0111-8d8e-471d-a7ab-7cf62ff160a7</guid>
      <pubDate>Fri, 8 Jan 2010 18:53:58 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/8_Single_step_to_Multistage_-_the_way_to_increase_cooling_level_in_detector_applications_files/2-stage%20TEC%20for%20X-Ray%20Detectors.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object074_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH introduces 2-stage thermoelectric cooler designed for simple substitution of standard single-stage 8x8mm TE coolers in various detector applications to archive higher cooling level. 8x8mm thermoelectric cooler on TO-8 style header is the one of typical solutions for X-Ray detectors and some IR sensing applications. In many cases a single-stage TEC provides enough cooling level for IR or X-Ray detector. However, the trend for signal resolution increasing and noise reducing may require lower operating temperatures, where two-stage TE cooler is more optimal.  </description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2010/1/8_Single_step_to_Multistage_-_the_way_to_increase_cooling_level_in_detector_applications_files/2-stage%20TEC%20for%20X-Ray%20Detectors.jpg" length="71531" type="image/jpeg"/>
    </item>
    <item>
      <title>Participating in Photonics West 2010 and OFC  2010 trade fairs</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/11/4_Participating_in_Photonics_West_2010_and_OFC_2010_trade_fairs.html</link>
      <guid isPermaLink="false">37ee912c-7942-4f57-ba08-7dfe68827027</guid>
      <pubDate>Wed, 4 Nov 2009 19:57:17 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/11/4_Participating_in_Photonics_West_2010_and_OFC_2010_trade_fairs_files/Exhibitions%20Banner.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object078_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:136px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH participates in Photonics West’10 and OFC’10 exhibitions in 2010. Welcome to visit our Booth # 4601 on January 26-28, San Francisco, The Moscone Center, German Pavilion during Photonics West 2010. The whole range of Thermoelectric Modules and Sub-Assemblies will be introduced together with latest developments. &lt;br/&gt;On March 23-25, please, visit our booth # 1214 in San Diego, San Diego Convention Center, German Pavilion. We will exhibit our thermoelectric cooling solutions for telecoms applications, including cooled TOSA solutions and HD technology TE coolers with up to 100% increased cooling capacity.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/11/4_Participating_in_Photonics_West_2010_and_OFC_2010_trade_fairs_files/Exhibitions%20Banner.jpg" length="50082" type="image/jpeg"/>
    </item>
    <item>
      <title>4-stage Cooling for Photodetector applications - new solution on standard TO-8 headers</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/9/25_4-stage_Cooling_for_Photodetector_applications_-_new_solution_on_standard_TO-8_headers.html</link>
      <guid isPermaLink="false">fa0c2b60-55f4-4bfc-9517-577565866600</guid>
      <pubDate>Fri, 25 Sep 2009 20:18:47 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/9/25_4-stage_Cooling_for_Photodetector_applications_-_new_solution_on_standard_TO-8_headers_files/TO8_4Stage_MD_Group.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object001_3.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:138px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH introduces two special Thermoelectric Cooling sub-assemblies on standard TO-8 headers for HgCdTe Photodetector Applications. The existing single solution on &lt;a href=&quot;Entries/2008/11/12_TO-8_and_TO-66_TE_sub-Assemblies_update.html&quot;&gt;TO-8 headers with 4MD04-116-xx&lt;/a&gt; type is supplemented  with new thermoelectric cooler type - 4MD04-160-xx TEC. Based on &lt;a href=&quot;../MD_Series_Overview.html&quot;&gt;RMT HD technology&lt;/a&gt; 4MD04-160-xx  TE cooler has the increased cooling capacity and unique size, sufficiently compact to fit on standard TO-8 headers. New thermoelectric sub-assembly provides up to 125 degree of maximum temperature difference and up to 0.8W cooling capacity. Both 4-stage thermoelectric cooling sub-assemblies are oriented mainly for Mercury Cadmium Telluride photodetectors and some other applications where operating at temperatures below 200K is required.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/9/25_4-stage_Cooling_for_Photodetector_applications_-_new_solution_on_standard_TO-8_headers_files/TO8_4Stage_MD_Group.jpg" length="110868" type="image/jpeg"/>
    </item>
    <item>
      <title>Z-Meters - Universal Solution for Thermoelectric Coolers Measurements and Quality Control</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/8/11_Z-Meters_-_Universal_Solution_for_Thermoelectric_Coolers_Measurements_and_Quality_Control.html</link>
      <guid isPermaLink="false">e1f92e46-9140-4982-a6af-ba233c3950d5</guid>
      <pubDate>Tue, 11 Aug 2009 10:06:21 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/8/11_Z-Meters_-_Universal_Solution_for_Thermoelectric_Coolers_Measurements_and_Quality_Control_files/IMG_0179.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object000_5.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:145px;&quot;/&gt;&lt;/a&gt;Thermoelectric (Peltier) Coolers (TECs) are the important part of a range of optoelectronic applications. Semiconductor lasers, DPSS lasers, Superluminescent diodes, Infrared and X-Ray detectors, Photon Counters, CCD and CMOS Imagers,  DNA cyclers, Medical Calorimeters and many other products require built-in miniature TECs for thermal management. Telecom industry utilizes thermoelectrically cooled LD in Butterfly or TOSA packages as standard and  consumes different types of miniature Peltier elements in great volumes. Many types of Infrared and X-Ray detectors provide best performance with thermoelectric cooling only. CCD matrixes, FPA and CMOS sensors demonstrate considerable sensitivity increase if thermoelectric cooling is applied. Large number of state-of-art laser and other optoelectronic devices has thermoelectric cooler as a standard element of design.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/8/11_Z-Meters_-_Universal_Solution_for_Thermoelectric_Coolers_Measurements_and_Quality_Control_files/IMG_0179.jpg" length="205291" type="image/jpeg"/>
    </item>
    <item>
      <title>Black Body Task - New Range of Thermoelectric Thermal Reference Source (TTRS) Products</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/22_Black_Body_Task_-_New_Range_of_Thermoelectric_Thermal_Reference_Source_%28TTRS%29_Products.html</link>
      <guid isPermaLink="false">19c5b0ad-6e3e-47b4-8cf9-e8fc645c93d1</guid>
      <pubDate>Wed, 22 Jul 2009 10:44:40 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/22_Black_Body_Task_-_New_Range_of_Thermoelectric_Thermal_Reference_Source_%28TTRS%29_Products_files/BB_Group.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object003_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:118px;&quot;/&gt;&lt;/a&gt;TEC Microsystems introduces new range of Thermoelectric Thermal Reference Source (TTRS) products based on TO-8, TO-3 and TO-822 headers. Thermoelectric Thermal Reference Source (TTRS) sub-assemblies provide a temperature-controllable, uniform-temperature, high-emissivity surface that is used in calibrating of infrared (IR) detector arrays and FLIR systems. When viewed by the FLIR system detectors, the TTRS enables the system electronics to perform gain and offset calibration as well as DC restoration for each pixel's preamp.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/22_Black_Body_Task_-_New_Range_of_Thermoelectric_Thermal_Reference_Source_%28TTRS%29_Products_files/BB_Group.jpg" length="88962" type="image/jpeg"/>
    </item>
    <item>
      <title>Power to Butterfly - New Series of Miniature Thermoelectric Coolers with increased Cooling Capacity</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/7_Power_to_Butterfly_-_New_Series_of_Miniature_Thermoelectric_Coolers_with_increased_Cooling_Capacity.html</link>
      <guid isPermaLink="false">47a361d4-2080-47cb-9be4-78ad064a9cad</guid>
      <pubDate>Tue, 7 Jul 2009 13:41:24 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/7_Power_to_Butterfly_-_New_Series_of_Miniature_Thermoelectric_Coolers_with_increased_Cooling_Capacity_files/BTF_Subs.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object1201_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:136px;&quot;/&gt;&lt;/a&gt;Modern applications in optical fibercom industry require more heat power to dissipate. Various High Power Tunable Lasers need a significant amount of heat to be dissipated for optimal performance and stable wavelength. Sometimes typical telecom TECs of 23, 29, 35 couples in de-facto standard Butterfly packages are not suitable for temperature stabilization in high power applications.  Developers and manufacturers have to switch for larger and more powerful TECs, but such types require more space and don't fit in standard Butterfly package. In this case the typical solution is using of HHL headers with integrated thermoelectric cooling, however such solution in most cases is significantly more expensive than Butterfly. &lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/7/7_Power_to_Butterfly_-_New_Series_of_Miniature_Thermoelectric_Coolers_with_increased_Cooling_Capacity_files/BTF_Subs.jpg" length="102957" type="image/jpeg"/>
    </item>
    <item>
      <title>Split and Concat - Elongated Thermoelectric Cooling Solutions</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/14_Split_and_Concat_-_Elongated_Thermoelectric_Cooling_Solutions.html</link>
      <guid isPermaLink="false">3f8bce37-30e5-46ba-bf54-8948e57289b5</guid>
      <pubDate>Thu, 14 May 2009 09:10:59 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/14_Split_and_Concat_-_Elongated_Thermoelectric_Cooling_Solutions_files/3-in-1.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object1202_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:118px;&quot;/&gt;&lt;/a&gt;In a certain amount of applications a thermoelectric (Peltier) cooler with  elongated shape is required. For instance, DPSS (Diode Pumped Solid State Lasers) may need TEC with rectangular shape to fit pump module and a holder with crystal, and some of them may need more space than typical telecom TEC dimensions can provide. Or another example - thermoelectric cooling for some CCD matrixes with long planar shape, like 10x110mm2 or so.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/14_Split_and_Concat_-_Elongated_Thermoelectric_Cooling_Solutions_files/3-in-1.jpg" length="94453" type="image/jpeg"/>
    </item>
    <item>
      <title>Laser Marking Service for Thermoelectric Sub-Assemblies is available now</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/12_Laser_Marking_Service_for_Thermoelectric_Sub-Assemblies_is_available_now.html</link>
      <guid isPermaLink="false">4c5a4e8f-d8ee-4cb8-a7bc-c4d169ff460c</guid>
      <pubDate>Tue, 12 May 2009 11:08:58 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/12_Laser_Marking_Service_for_Thermoelectric_Sub-Assemblies_is_available_now_files/TO816.2MC0406312_Group.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object1203_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:88px;&quot;/&gt;&lt;/a&gt;TEC Microsystems introduces new option available for Thermoelectric Sub-Assemblies. Headers and Packages with mounted thermoelectric coolers now can be marked with laser marking. It simplifies quality control, stock operation and identification process on customer side.&lt;br/&gt;Headers can be marked with various identification numbers upon customer request or (and) additional symbols - for instance thermoelectric cooler polarity, thermistor pins or package ground pin. &lt;br/&gt;Such labeling is useful for example with Sub-Assemblies on TO-style packages like TO-8 or TO-3, where TEC pins or ground pins can be not so easy to indicate after final packaging, when a cap is mounted.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/5/12_Laser_Marking_Service_for_Thermoelectric_Sub-Assemblies_is_available_now_files/TO816.2MC0406312_Group.jpg" length="38551" type="image/jpeg"/>
    </item>
    <item>
      <title>Participating in Laser 2009 trade fair in Munich</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/17_Participating_in_Laser_2009_trade_fair_in_Munich.html</link>
      <guid isPermaLink="false">597c48b9-48ed-4bc0-bfab-0ebd9dde03a8</guid>
      <pubDate>Fri, 17 Apr 2009 12:28:23 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/17_Participating_in_Laser_2009_trade_fair_in_Munich_files/Picture%204.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object002_2.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:136px;&quot;/&gt;&lt;/a&gt;TEC Microsystems GmbH participates in Laser 2009 Exhibition in Munich. Welcome to visit our Booth # 462 on June 15-18, Hall B1. Together with RMT Ltd we will introduce the whole range of Thermoelectric Modules and Sub-Assemblies , Temperature Controllers and Measuring devices for thermoelectric coolers.&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/17_Participating_in_Laser_2009_trade_fair_in_Munich_files/Picture%204.jpg" length="30021" type="image/jpeg"/>
    </item>
    <item>
      <title>Inside a Butterfly - Miniature Thermoelectric Coolers for Telecom Applications</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/6_Inside_a_Butterfly_-_Miniature_Thermoelectric_Coolers_for_Telecom_Applications.html</link>
      <guid isPermaLink="false">56b1c57f-266c-47e7-8454-a0a3d4dbeb60</guid>
      <pubDate>Mon, 6 Apr 2009 12:10:43 +0200</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/6_Inside_a_Butterfly_-_Miniature_Thermoelectric_Coolers_for_Telecom_Applications_files/Butterfly_Package_with_thermoelectric_cooler2.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object242_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:137px;&quot;/&gt;&lt;/a&gt;Tunable lasers have become an industry standard for DWDM applications, providing flexible wavelength-routing capabilities and realizing the all-optical network. Five main basic tunable lasers structures (DFB, VCSEL, DBR, SGDBR, ECL) have one common feature - the importance of temperature stabilization for optimal operating. DWDM Lasers require precise temperature stabilization to isolate LD from ambient temperature conditions, keep wavelength stable and provide long distance transmission. &lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/4/6_Inside_a_Butterfly_-_Miniature_Thermoelectric_Coolers_for_Telecom_Applications_files/Butterfly_Package_with_thermoelectric_cooler2.jpg" length="83794" type="image/jpeg"/>
    </item>
    <item>
      <title>Going TOSA - Thermoelectric Coolers for Cooled TOSA Applications</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/3/12_Going_TOSA_-_Thermoelectric_Coolers_for_Cooled_TOSA_Applications.html</link>
      <guid isPermaLink="false">b22d43cc-faee-4e50-bfac-06f3fb3c2a45</guid>
      <pubDate>Thu, 12 Mar 2009 10:24:20 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/3/12_Going_TOSA_-_Thermoelectric_Coolers_for_Cooled_TOSA_Applications_files/TE_Cooled_TOSA_1MD04-017-05_1_.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object1206_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:137px;&quot;/&gt;&lt;/a&gt;The trends for small form factor and low power dissipation have made cooled TOSA (Transmitter Optical Sub-Assembly) solutions very popular. TEC Microsystems introduces a range of miniature high-efficient thermoelectric coolers for cooled TOSA applications. Different TEC types, designed specially for TO-can TOSA (5.6mm) and box-like TOSA MSA, are available in our standard product range.  Here we specify our standard solutions for cooled TOSA applications.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/3/12_Going_TOSA_-_Thermoelectric_Coolers_for_Cooled_TOSA_Applications_files/TE_Cooled_TOSA_1MD04-017-05_1_.jpg" length="130556" type="image/jpeg"/>
    </item>
    <item>
      <title>New Thermoelectric Catalog 2009 is available</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/1/12_New_Thermoelectric_Catalog_2009_is_available.html</link>
      <guid isPermaLink="false">70a0cec1-4796-4093-abe0-9dc657b6f9c7</guid>
      <pubDate>Mon, 12 Jan 2009 16:07:24 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/1/12_New_Thermoelectric_Catalog_2009_is_available_files/Catalog_3.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object011_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:256px;&quot;/&gt;&lt;/a&gt;New catalogue 2009 of RMT thermoelectric products  is available for downloading. Detailed documentation on RMT thermoelectric products is presented:&lt;br/&gt;	•	   Thermoelectric cooling modules&lt;br/&gt;	•	   Thermoelectric sub-mounts&lt;br/&gt;	•	   Thermistors&lt;br/&gt;	•	   Z-Meters&lt;br/&gt;	•	   TECCad&lt;br/&gt;&lt;br/&gt;The electronic version is available on RMT web site by this &lt;a href=&quot;http://www.rmtltd.ru/catalogues/TEC2009.pdf&quot;&gt;link&lt;/a&gt; (direct, 12Mb). Please, contact us for a free hard copy&lt;br/&gt;</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2009/1/12_New_Thermoelectric_Catalog_2009_is_available_files/Catalog_3.jpg" length="36138" type="image/jpeg"/>
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    <item>
      <title>New modular Temperature Controllers for Thermoelectric Cooling applications</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/16_New_modular_TEC_controllers.html</link>
      <guid isPermaLink="false">10d93688-fb65-41be-a138-83487c4970d4</guid>
      <pubDate>Tue, 16 Dec 2008 17:39:45 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/16_New_modular_TEC_controllers_files/DSC02592.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object245_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:137px;&quot;/&gt;&lt;/a&gt;Introducing new Series of miniature Temperature Controllers DX5100 for thermoelectric (Peltier) cooling applications. The series is based on modular concept which allows to provide different models of OEM TEC controllers by number of controlled thermoelectric modules. Versions with one and two channels are available with a scalability for complex systems with up to 128 channels. Various ranges of thermoelectric (Peltier) cooler power, thermosensor types, operation modes are supported. The key features are built-in thermoelectric cooler conditions control, high efficient electrical power converters (85%), miniature size and connection scalability. </description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/16_New_modular_TEC_controllers_files/DSC02592.jpg" length="207587" type="image/jpeg"/>
    </item>
    <item>
      <title>Top Expanding - New MDX Series of Two-Stage TECs</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/4_Top_Expanding_-_New_MDX_Series_of_Two-Stage_TECs.html</link>
      <guid isPermaLink="false">3f0ccaa6-94d7-4c94-a3f4-6b1688989b69</guid>
      <pubDate>Thu, 4 Dec 2008 09:45:15 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/4_Top_Expanding_-_New_MDX_Series_of_Two-Stage_TECs_files/MDX06_Series_Scene.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object002_3.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:183px; height:137px;&quot;/&gt;&lt;/a&gt;TEC Microsystems introduces two new Series of miniature thermoelectric modules - &lt;a href=&quot;../MDX04_Thermoelectric_Coolers.html&quot;&gt;MDX04&lt;/a&gt; and &lt;a href=&quot;../MDX06_Thermoelectric_Coolers.html&quot;&gt;MDX06&lt;/a&gt;. Both Series consist of two-stage coolers, based on high-density pellets placement and combination of serial/parallel connections inside TEC.  The main advantages of new thermoelectric coolers are increased cooling power and same size for top and bottom ceramics (instead of classic pyramidal shape). Please, read more in TE Series description page by this &lt;a href=&quot;../Thermoelectric_Coolers.html&quot;&gt;link&lt;/a&gt;.</description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/12/4_Top_Expanding_-_New_MDX_Series_of_Two-Stage_TECs_files/MDX06_Series_Scene.jpg" length="50733" type="image/jpeg"/>
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    <item>
      <title>Find It Fast - Online Tec Select Assistant</title>
      <link>http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/11/27_Find_It_Fast_-_Online_Tec_Select_Assistant.html</link>
      <guid isPermaLink="false">33f65d02-d16c-4cae-ac28-71702f961dbe</guid>
      <pubDate>Thu, 27 Nov 2008 19:59:06 +0100</pubDate>
      <description>&lt;a href=&quot;http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/11/27_Find_It_Fast_-_Online_Tec_Select_Assistant_files/TEC%20Select%20Assistant-leveled.jpg&quot;&gt;&lt;img src=&quot;http://www.tec-microsystems.com/EN/Blog_news/Media/object1210_1.jpg&quot; style=&quot;float:left; padding-right:10px; padding-bottom:10px; width:182px; height:137px;&quot;/&gt;&lt;/a&gt;TEC Microsystems presents Online TEC Select Assistant. It provides brief search among all the nomenclature of our thermoelectric modules, and finds the most suitable thermoelectric modules for customer’s application. The following analysis at different ambient and operating conditions can be done within TECCad software. </description>
      <enclosure url="http://www.tec-microsystems.com/EN/Blog_news/Entries/2008/11/27_Find_It_Fast_-_Online_Tec_Select_Assistant_files/TEC%20Select%20Assistant-leveled.jpg" length="39318" type="image/jpeg"/>
    </item>
  </channel>
</rss>
