HHL packages are used in high power applications. The internal space makes it able to fit TEC with dimensions up to 12x25.0mm2 and cooling power up to 30W.

HHL 9pin Header

TE Cooler

  1. A.Header Material

    Base -CuW


  1. B.Header Surface Finish

    Gold Plaiting


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plaiting

  5. b.Au plaiting

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

HHL 9pin Standard

Thermistor

TEC to Header

Mounting (Soldering)

HHL 9pin Low-Height

HHL 9pin Side-Output

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

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Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_hhl.htm

TEC to Header

Pins Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

© TEC Microsystems GmbH 2008

  1. ‣The special box-like high heat load (HHL) package. 

  2. ‣The base material can be various: Kovar, CRS, CuW, CuMo.

  3. ‣Gold or Nickel plating is available.

  4. ‣The number of pins is usual - 9 (one-side).

  5. ‣The header surface open for mounting is about 25 x 25 mm2.

  6. ‣Complex designs with one or two TE modules are available.

  7. ‣Solutions with large powerful TE modules are possible