© TEC Microsystems GmbH 2008
TEC Microsystems presents two standard and universal thermoelectric solutions, based on Peltier modules with 16x16mm2 dimensions with 30W cooling power: types 1MC06-126-05 and 1MX06-063-05.
Thermoelectric module 1MC06-126-05 is the one of most popular TECs applied to HHL packages applications. 1MX06-063-05 is the new one, developed recently. Both types have 16x16mm2 dimensions with five height and performance options available. The main difference between 1MX06-063-05 and 1MC06-126-05 is in Imax/Umax parameters combination. 1MX06-063-05 TEC is recommended to use with drivers limited by voltage (12V and less).
Different Current/Voltage combination of 1MX06-063-05 TEC is provided by another connection type of Bi-Te elements inside the TEC. Both TEC types, 1MC06-126-05 and 1MX06-063-05, have the same number of pellet pairs - 126, but connected serial in MC and parallel in MX type. Thus, 1MC06-126-05 and 1MX06-063-05 are twins for HHL packages applications. They have the same geometry and cooling power, providing also a flexibility for using with different power supplies.
Standard HHL Sub-Mount with TEC
TEC Microsystems GmbH provides an assemblies of specified TECs into standard HHL packages. Different options for TEC cold side ceramics are available. It can be blank, metallized (Ni-Sn, or Au) or metallized and pre-tinned with a range of standard solders.
The complete description of standard HHL Sub-mount assembling procedure and standard options is available here.