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The most powerful Subseries of MC thermoelectric Coolers. The main applications where MC10 thermoelectric modules can be used is active cooling of FPA (Focal Plane Arrays), CMOS and CCD imagers and detectors. The MC10 series consists of more than 65 different TECs. It is also suitable for cooling and thermostabilization of other optoelectronic devices, IR instruments and elements of microelectronics, where large cold surface is required.

MC10 Series TECs are based on 1.0x1.0mm2 pellet cross-section. Single- and Multistage types are available. Each has three different height/performance options, various options for ceramics surface and wires.

Thermoelectric Cooling Modules of MC10 Series

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Ceramics Options
Internal Assembling Solder
TEC Shape
Wires and Wire Bonding Solutions
Surface Finish
Customized Au Surface Patterns
Thermistor Mounting
Protection Coating
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