1. ‣The packages are of different styles, optimized for detector applications - focal plane arrays (FPA) and linear arrays.

  2. ‣The base material typically: kovar or cold rolled steel (CRS).

  3. ‣Ni or Au plating is available. Ni plating is typical.

  4. ‣The number of pins is customized

  5. ‣Cooling solutions with various types of TE modules from single to multistage types, optimized for particular package.

  6. ‣Thermistors are available on request

Single- and multistage TE Solutions available on MS-28 header. Quad shape provides a possibility to mount themoelectric coolers with dimensions up 16.0x16.0mm2. MS-32 Header has a hole for vacuum sealing. Solder seal method is preferable. Package version with Copper Tube for sealing is also available.

Click here to explore all available sub-mounts with detailed datasheets

FPA MS-32 Header

TE Cooler

  1. A.Header Material

    CRS   


  1. B.Header Surface Finish

    Ni, Gold Plaited Pins


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

MS-32 Package type

TEC to Header

Mounting (Soldering)

Dimensions are in millimeters

Thermistor to Header Pins Mounting (Soldering)

TEC to Header Pins Mounting (Soldering)

Thermistor

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_ms32.htm

© TEC Microsystems GmbH 2008