Welcome to our updated web site. We have added more details about our products and technologies. Thermoelectric Sub-Mounts section was expanded with detailed descriptions of available standard types, assembling technology process and rough package drawings. Click here for detailed information.
A new section was created introducing packages/housings/headers. Click here to get information on standard packages and headers available without cooling.
March 04, 2008
Visit us at Photonics West 2008 Exhibition, Hall 1, German Orange Booth #1801-21.
Participating in Photonics West 2008
January 19-24, 2008
TEC Microsystems web starts working
September 14, 2007
TEC Microsystems GmbH becomes a member of OpTecBB
Optec-Berlin-Brandenburg (OpTecBB) is an initiative of companies, universities and scientific institutes to strengthening the economic power of the Berlin-Brandenburg region through joint activities using the potential of the optical technologies
Optec-Berlin-Brandenburg Membership
March 13, 2007
New catalogue of RMT thermoelectric products is available for downloading. Detailed documentation on RMT thermoelectric products is presented:
- Thermoelectric cooling modules
- Thermoelectric sub-mounts
- Thermistors
- Z-Meters
- TECCad
The electronic version is available on RMT web site by this link (direct, 12Mb).
Please, contact us for a free hard copy
New RMT Ltd Catalog available
January 22, 2007
A production line is in set-up process in Berlin-Adlershof, Germany’s largest science and technology park.
TEC Microsystems GmbH is founded
January 11, 2007
Web Site Updated
TEC Microsystems introduces MD TEC Series of thermoelectric modules with high-density pellets placement. The main feature of this series of miniature TE modules is an increased cooling capacity (up to 13-14 W/cm2).
March 15, 2008
We’re glad to advise about availability of thermoelectric module, specially optimized for TO-46 VCSELs. 1MD04-003-xx type from RMT MD Series provides up to 400mW of cooling power (the appropriate heat sink is required). This TEC is specially designed for TO-46 Header and optimized for Wire Bonding mounting. Please, read more about it here.
March 19, 2008
thermoelectric cooling for to-46 headers
TEC Microsystems presents two 30W TE modules, optimized for using with HHL packages. Both have the same size and cooling power, but different Imax/Umax parameters combination. Please, read more about it here.
April 18, 2008
HHL “Twins” - two popular TE cooling solutions for HHL applications
TEC Microsystems presents new TE Sub-mounts (TEC+Header) based on TO-822 Header. It has an open space for mounting TEC up to 12x12mm2 size. This header is useful for applications where typical TO-8 Header is not enough. Most of standard RMT Ltd TECs can be mounted onto TO-822 header. TEC Microsystems introduces a range of most interesting TE solutions.
MAY 30, 2008
TO-822 TE Sub-mounts - space to fit more (New thermoelectric sub-mount types)
TEC Microsystems introduces new high-power thermoelectric cooling solution for TO-3 headers applications. TO-3 Sub-mounts with up to 10W of cooling power are available. The solution is based on new thermoelectric cooler type with more than 50% increased cooling power. Please, read more about it here.
JULY 08, 2008
TO-3 TE Sub-mounts - higher cooling power within the same size
TEC Microsystems introduces cost-effective solution for thermistors. Using of standard SMT Chip thermistors types instead of glass-beaded significantly reduces the price of integrated temperature control for TE modules and assemblies. Please, read more about it here.
august 19, 2008
Chip is cheap - COST-effective thermistor solution
New Qualification Program of TECs of all existing series is completed. More than 500 TECs were exposed to the life tests during more than 150 000 device-hours of operation. More than 100 TECs were exposed for the mechanical tests. The results indicate that all TECs provided by TEC Microsystems meet the requirements of Telcordia GR-468 Standard.
Please, contact us to get a complete Reliability Report 2008.
october 17, 2008
Reliability report 2008 is available
TEC Microsystems introduces three new thermoelectric cooler (TEC) types of 1MC10 TEC Series for CMOS and CCD detectors active cooling. There are three new single- stage TECs available now with dimensions 12x12mm, 15x15mm and 18x18mm - required usually for cooling in CMOS and CCD image detectors applications. Please, read more about it here.
November 07, 2008
New thermoelectric TO-8 and TO-66 Sub-Assemblies types are available. The standard range of TO-8 and TO-66 Sub-Assemblies is expanded with new TECs from MD Series, single- and multistage types. MD Series high-density pellets conception provides more pellets on the same size or more compact TECs with the same number of pellets as regular types. Please, read more about it here.
November 12, 2008
© TEC Microsystems GmbH 2008