1. The package is flat, specialized for array detector applications.

  2. The base material can be Kovar or cold rolled steel (CRS).

  3. Gold or Nickel plating.

  4. The number of pins is customized (usually 28 pins).

  5. The package surface open for mounting is about 33 x 17 mm2.

  6. Solutions with quite large powerful TE modules are possible.

  7. Array detector applications are involved

Single- and multistage TE Solutions available on PS-28 header. Elongated shape provides a possibility to mount themoelectric coolers with dimensions up 12.0x24.0mm2. This is a standard header for CCD matrixes.

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CCD PS-28 Header

TE Cooler

  1. A.Header Material

    CRS   


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

PS-28 Package type

TEC to Header

Mounting (Soldering)

Dimensions are in millimeters

Thermistor to Header Pins Mounting (Soldering)

TEC to Header Pins Mounting (Soldering)

Thermistor

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Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_ccd.htm

© TEC Microsystems GmbH 2008