PS-28 Sub-Mounts
 
  1. The package is flat, specialized for array detector applications.

  2. The base material can be Kovar or cold rolled steel (CRS).

  3. Gold or Nickel plating.

  4. The number of pins is customized (usually 28 pins).

  5. The package surface open for mounting is about 33 x 17 mm2.

  6. Solutions with quite large powerful TE coolers are possible.

  7. Array detector applications are involved

Single- and multistage thermoelectric coolers available for PS-28 header. Elongated shape provides a possibility to mount thermoelectric coolers with dimensions up 12.0x24.0mm2. This is a standard header for CCD matrixes.

Click here to explore all available sub-mounts with detailed datasheets

CCD PS-28 Header

Thermoelectric Cooler

  1. A.Header Material

    CRS   


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

PS-28 Package type

TEC to Header

Mounting (Soldering)

Dimensions are in millimeters

Thermistor to Header Pins Mounting (Soldering)

TEC to Header Pins Mounting (Soldering)

Thermistor

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Thermoelectric Sub-Assemblies for CCD and FPA applications
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_ccd.htm
Assembling Options
Packages available

© TEC Microsystems GmbH 2012