Manufacturing Options for thermoelectric modules

Standard TE module types are produced using one of the following ceramics:

Alumina Al2O3 100%
Alumina Al2O3 96%
Aluminum Nitride AlN 100%

The Alumina (100% or 96%) is default for most of the standard TE modules (MC, MD, and MP Series).

Standard ceramics thicknesses are 0.5mm for Alumina and 0.25mm for Aluminum Nitride. AlN ceramics is used for telecom ML Series as standard and optional TEC types manufacturing.

RMT produces several shape options of TECs to fit various applications. The options differ by electric wires configuration and the hot side shape of a module:

Standard Option (The MC04 and MC06 TEC Series). The hot side has two symmetrical porches for wires carrying. The wires are perpendicular to the longer side of the hot surface.
Option 1. The hot and top sides are equal. No porches for wires carrying.
Option 2. The hot side has a porch for wires carrying. The wires are perpendicular to the shorter side of the hot face.
Telecom Option (ML Series). The cold and hot sides are equal and elongated. The wires are perpendicular to the shorter side of the hot sides.

All the TE modules of the standard series can be manufactured in one of the listed options. Standard option for each series is mentioned at specifications, others are available according to request.

Standard

Option 1

Option 2

Telecomm

Standard TECs are made with naked wires. The wire thickness is applied depending on TEC power consumption (electric current Imax). The following options are available on request:

optional thickness, length and material of wires
insulated wires
bonding pads suitable for wirebonding
mounting posts

Standard Wire Solution

Wire Bonding Pads

Wire Bonding Posts

Color Coded Wires

The following finish of cold and hot sides of TE modules is available:

Blank (naked) ceramics
Metallized (gold plating or Ni/Sn)
Metallized and Pre-tinned surfaces. A range of solders can be applied for pre-tinning by request.

Different combinations of the cold and hot sides finish are available on request, for instance, gold plated hot side and naked ceramics cold side.

Blank Ceramics

Metallized, Ni-Sn

Metallized Au plated

Metallized and Pre-Tinned

On customer demand thin film conductive patterns can be printed directly onto the TEC cold side.

Applications - direct mounting of laser, CCD, photodetector chips on TE module cold side surface.

Typical plating:

Gold plating, provided for wire bonding.
Ni/Sn plating for solderability
Selective pre-tinning also possible

Customized Au patten for LD applications

Mounting of miniature NTC thermistors or other type thermosensors on a TEC cold side is available on request.

RMT provides miniature glass-beaded thermistors for this use with 10kOhm@20C and 2.2kOhm@20C nominals.

The mounting method is thermoconductive epoxy gluing to the cold side lateral surface or as demanded.

Mounting to cold ceramics edge

RMT advises a patented protection of TE modules by a very thin (a few microns) coating layer that covers all internal surfaces of the TEC:

Parylene layer
Very thin (5-20 µm) coating
All-over protection
No TE module performance change

The protection enables TEC operation in wet or aggressive environment. It yields no dust or particles. Higher mechanical strength of pellets is ensured.

Patents# RU41549U1, WO2006/006884A1

RMT uses lead-free Solder 230 (Sn-Sb, Tmelt=230ºC) as standard for all TEC products range.

All standard TECs are produced in accordance with the requirements of RoHS (Directive 2002/95/EC on restriction of the use of certain hazardous substances in electrical and electronic equipment).

RMT standard TECs do not contain restricted substances. They are Lead-Free and are marked correspondingly.