TO-39 Header open surface provides a possibility to install various single- and multi-stage TECs types. Header version with 8 pins is standard and mostly requested. TO-39 Header 6pins version is available as a cost-effective solution.

TO-39 Header

TE Cooler

TEC Contacting to Header Pins

(Soldering)

  1. A.Header Material

    Kovar


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

TO-39 8pin

TO-39 6pin

Thermistor

TEC to Header Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_to39.htm
Packages availableThermoelectric_Modules.html

© TEC Microsystems GmbH 2008

  1. ‣Very small package (for cooling solutions).

  2. ‣The package is of 9.14 mm diameter.

  3. ‣The number of pins is up to 8 (usually 4 ... 8 pins).

  4. ‣Header surface open for mounting is 3.2 x 3.2 mm2.

  5. ‣Solutions with one- and two-stage TE modules are possible.

  6. ‣The sub-mount base thermal resistance is usually high.