The special micro-TEC has been developed for TO-46 Sub-mounts. This is 1MD04-003-xx type, optimized for wire-bonding. There are six different height and performance options available.

TO-46 Header

TE Cooler

TEC to Header Mounting

(Soldering)

TEC Contacting to Header Pins

WB Solution available as Standard

WB Contacts

WB Pads

  1. A.Header Material

    Kovar


  1. B.Header Surface Finish

    Gold Plaiting


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    WB solution only


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plaiting

  5. b.Au plaiting

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    N/A due to Header limited

    pins number

TO-46 5pin

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_to46.htm

© TEC Microsystems GmbH 2008

  1. ‣Very miniature TO-style package with limited area for mounting.

  2. ‣Now is popular for VCSEL, photodetectors and other miniature electronic components.

  3. ‣Solutions with miniature single-stage TE modules are possible.

  4. ‣The sub-mount base thermal resistance is high.

  5. ‣The mounting methods are soldering or gluing.