Thermoelectric Cooling Solutions on TO-66 Headers

‣The package is diamond-like shape.
‣The base material is usually Kovar or cold rolled steel (CRS).
‣Gold or Ni plating.
‣The number of pins is up to 9 (usually 6 or 9 pins).
‣The header surface open for mounting is 8 x 8 mm2.
‣Solutions with single- to three-stage TE modules are possible.
‣A thermosensor (NTC thermistor) is available.

TO-66 Header

TE Cooler

TEC Contacting to Header Pins

(Soldering)

A.Header Material

Kovar

B.Header Surface Finish

Gold Plating

C.TEC Mounting
1. Soldering
a.Solder 138, Sn-Bi, Tmelt=138ºC
b.Solder 199, Sn-Zn, Tmelt=199ºC
3. Epoxy Gluing

D.TEC Leads Connections

Soldering Sn-Sb, Tmelt=230ºC

E.TEC Cold Side Finish
1.Blank Ceramics
2.Metallized Ceramics
a.Ni/Sn plating
b.Au plating
3.Metallized and Pre-tinned
a.Solder 117, In-Sn, Tmelt=117ºC
b.Solder 138, Sn-Bi, Tmelt=138ºC

F.Thermistor (Optional)

RMT’s TB type NTC thermistor

1.10kOhm@20C, 5%
2.2.2kOhm@20C, 5%

Individual calibration available

Mounting by Epoxy Gluing

TO-66 9pin

Thermistor

TEC to Header

Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

TO-66 6pin

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

TO-66 Header is a “diamond”-like analog of TO-8 header. It’s open surface provides a possibility to install various single- and multi-stage TECs types. Header version with 9 pins is standard and mostly requested. Other types available by request.