TO-822 header has relatively large open space area to mount powerful single-stage TECs with cold side up to 12x12mm2. It is also good solution for typical pyramidal multistage TECs, especially three and four-stage types, where bottom (hot side) ceramics may be significantly larger then top. TO-822 header is good solution for applications where standard TO-8 header is not enough by space.

TO-822 Header

TE Cooler

TEC Contacting to Header Pins

(Soldering)

  1. A.Header Material

    Kovar


  1. B.Header Surface Finish

  2. 1. Gold Plating

  3. 2. Ni Plating (Au plated Pins)


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

TO-822 12pin

Thermistor

TEC to Header Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

Dimensions are in millimeters

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Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_to39.htm
Packages availableThermoelectric_Modules.html

© TEC Microsystems GmbH 2008

  1. ‣The package is of 20.9 mm (0.822”) diameter.

  2. ‣The base material is Kovar.

  3. ‣Gold or Nickel plating is available.

  4. ‣The number of pins is 12.

  5. ‣Header surface open for mounting is 12.5 x 12.5 mm2.

  6. ‣Solutions with single- and multistage TE modules are possible.