1. The package is of 0.6 inch (15.4 mm) diameter.

  2. The base material is Kovar.

  3. Gold or Nickel plating is available.

  4. The number of pins is up to 16 (usually 6…16).

  5. The header surface open for mounting is 8 x 8 mm2.

  6. Mounting of single- to three-stage TE modules is possible.

  7. A thermosensor (NTC thermistor) is available

TO-8 Header is widely used in laser and optoelectronics applications. It’s open surface provides a possibility to install various single- and multi-stage TECs types. Different options available by number of pins and availability of screw. Typically used 12pin version with 4-40UNC screw.

TO-8 Header

TE Cooler

TEC Contacting to Header Pins

(Soldering)

  1. A.Header Material

    Kovar


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

TO-8 12pin

Thermistor

TEC to Header

Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

TO-8 6pin

TO-8 16pin

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_to8.htm

© TEC Microsystems GmbH 2008