There are different thermoelectric coolers available for Cooled TOSA applications. All are from special MD TEC Series, developed by RMT with high density pellets placement.

TOSA Header

Thermoelectric Cooler

  1. A.Header Material

    Base -Kovar, CuW


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

TOSA 9pin 2.5Gb

with Sapphire Window

TEC to Header

Mounting (Soldering)

TEC WB Solution

Available with or without WB Posts

TOSA 9pin 2.5Gb

with ball Lense

TOSA 8pin 10Gb

with ball Lense

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

Back to Sub-Mounts SelectionTE_Sub-Mounts.html
Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_tosa.htm

© TEC Microsystems GmbH 2010

  1. ‣Low form factor packages meet the high performance requirements for 2.5Gb/s & 10Gb/s Transmitter Optical Sub-Assembly (TOSA).

  2. ‣Ultra compact design compliant with XMD MSA standard package definition.

  3. ‣Solutions with miniature single-stage TE COOLERS are possible.

  4. ‣The sub-mount base thermal resistance is relatively small

  5. ‣The mounting methods are soldering or gluing.