Welcome to our updated web site. We have added more details about our products and technologies. Thermoelectric Sub-Mounts section was expanded with detailed descriptions of available standard types, assembling technology process and rough package drawings. Click here for detailed information.

A new section was created introducing packages/housings/headers. Click here to get information on standard packages and headers available without cooling.

March 04, 2008

Visit us at Photonics West 2008 Exhibition, Hall 1, German  Orange  Booth #1801-21.

Participating in Photonics West 2008

January 19-24, 2008

TEC Microsystems web starts working

September 14, 2007

TEC Microsystems GmbH becomes a member of OpTecBB

Optec-Berlin-Brandenburg (OpTecBB) is an initiative of companies, universities and scientific institutes to strengthening the economic power of the Berlin-Brandenburg region through joint activities using the potential of the optical technologies

Optec-Berlin-Brandenburg Membership

March 13, 2007

New catalogue of RMT thermoelectric products  is available for downloading. Detailed documentation on RMT thermoelectric products is presented:

   - Thermoelectric cooling modules

   - Thermoelectric sub-mounts

   - Thermistors

   - Z-Meters

   - TECCad


The electronic version is available on RMT web site by this link (direct, 12Mb).

Please, contact us for a free hard copy

New RMT Ltd Catalog available

January 22, 2007

A production line is in set-up process in Berlin-Adlershof, Germany’s largest science and technology park.

TEC Microsystems GmbH is founded

January 11, 2007

HomeHome_JP.html

Web Site Updated

TEC Microsystems introduces MD TEC Series of thermoelectric modules with high-density pellets placement. The main feature of this series of miniature TE modules is an increased cooling capacity (up to 13-14 W/cm2).

March 15, 2008

Introducing MD series of miniature thermoelectric modules../EN/MD_Series_Overview.html

We’re glad to advise about availability of thermoelectric module, specially optimized for TO-46 VCSELs. 1MD04-003-xx type from RMT MD Series provides up to 400mW of cooling power (the appropriate heat sink is required). This TEC is specially designed for TO-46 Header and optimized for Wire Bonding mounting. Please, read more about it here.

March 19, 2008

thermoelectric cooling for to-46 headers

TEC Microsystems presents two 30W TE modules, optimized for using with HHL packages. Both have the same size and cooling power, but different Imax/Umax parameters combination. Please, read more about it here.

April 18, 2008

HHL “Twins” - two popular TE cooling solutions for HHL applications

TEC Microsystems presents new TE Sub-mounts (TEC+Header) based on TO-822 Header. It has an open space for mounting TEC up to 12x12mm2 size. This header is useful for applications where typical TO-8 Header is not enough. Most of standard RMT Ltd TECs can be mounted onto TO-822 header. TEC Microsystems introduces a range of most interesting TE solutions.

MAY 30, 2008

TO-822 TE Sub-mounts - space to fit more (New thermoelectric sub-mount types)

TEC Microsystems introduces new high-power thermoelectric cooling solution for TO-3 headers applications. TO-3 Sub-mounts with up to 10W of cooling power are available. The solution is based on new thermoelectric cooler type with more than 50% increased cooling power. Please, read more about it here.

JULY 08, 2008

TO-3 TE Sub-mounts - higher cooling power within the same size

TEC Microsystems introduces cost-effective solution for thermistors. Using of standard SMT Chip thermistors types instead of glass-beaded significantly reduces the price of integrated temperature control for TE modules and assemblies.   Please, read more about it here.

august  19, 2008

Chip is cheap - COST-effective thermistor solution

New Qualification Program of TECs of all existing series is completed. More than 500 TECs were exposed to the life tests during more than 150 000 device-hours of operation. More than 100 TECs were exposed for the mechanical tests. The results indicate that all TECs provided by TEC Microsystems meet the requirements of Telcordia GR-468 Standard.

Please, contact us to get a complete Reliability Report 2008.

october  17, 2008

Reliability report 2008 is available

TEC Microsystems introduces three new thermoelectric cooler (TEC) types of 1MC10 TEC Series for CMOS and CCD detectors active cooling. There are three new single- stage TECs available now with dimensions 12x12mm, 15x15mm and 18x18mm - required usually for cooling in CMOS and CCD image detectors applications. Please, read more about it here.

November  07, 2008

New TECs for CCD and CMOS cooling../EN/New_MC10_TECs.html

    New thermoelectric TO-8 and TO-66 Sub-Assemblies types are available. The standard range of TO-8 and TO-66 Sub-Assemblies is expanded with new TECs from MD Series, single- and multistage types. MD Series high-density pellets conception provides more pellets on the same size or more compact TECs with the same number of pellets as regular types. Please, read more about it here.

November  12, 2008

TO-8 and TO-66 TE sub-Assemblies update../EN/New_MC10_TECs.html