In a large number of applications thermoelectric modules are incorporated into packages or mounted on headers. Our core competence is to provide a fully tested sub-mount (package+TEC assembly) minimizing this way the risk of possible damage of TECs during mounting process for our customers. Our specialists professionally solder the thermoelectric module on our standard headers / packages or in housings provided by the customer. TECs will undergo testing twice - before and after mounting. This will increase reliability of your final product.
Our service starts from low volumes for fast prototyping up to high volume production. Moreover, during product development we can offer consulting in the field of thermoelectric cooling.
TO-46
TO-39
TO-37
TO-8
TO-66
TO-3
TOSA
Butterfly
HHL
CCD PS-28
FPA MS-32
© TEC Microsystems GmbH 2008
TO-822
