TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

Performance @27ºC, Vacuum 

Performance @50ºC, Dry N2 

Cold Side

Hot Side

Height

TEC TYPE

dTmax

Qmax

Imax

Umax

ACR

dTmax

Qmax

Imax

Umax

ACR

A

B

C

D

H


K

W

A

V

Ohm

K

W

A

V

Ohm

mm

mm

mm

mm

mm

3MDC04-071-xx

3MDC04-071-03

105

1.2

1.6

5.5

2.90

99

1.5

1.6

6.2

3.22

6.2

6.2

6.2

6.2

3.1

3MDC04-071-05

109

0.8

1.0

5.6

4.72

96

0.9

1.0

6.3

5.26

6.2

6.2

6.2

6.2

3.8

3MDC04-071-08

109

0.5

0.7

5.7

7.45

88

0.6

0.7

6.4

8.32

6.2

6.2

6.2

6.2

4.7

3MDC04-071-10

109

0.4

0.5

5.8

9.27

84

0.5

0.6

6.5

10.36

6.2

6.2

6.2

6.2

5.3

3MDC04-071-xxAN (AlN ceramics)

3MDC04-071-03AN

107

1.3

1.6

5.5

2.90

102

1.5

1.7

6.2

3.22

6.2

6.2

6.2

6.2

3.1

3MDC04-071-05AN

110

0.8

1.0

5.6

4.72

97

1.0

1.1

6.4

5.26

6.2

6.2

6.2

6.2

3.8

3MDC04-071-08AN

110

0.5

0.7

5.7

7.45

89

0.6

0.7

6.5

8.32

6.2

6.2

6.2

6.2

4.7

3MDC04-071-10AN

109

0.4

0.5

5.7

9.27

84

0.5

0.6

6.6

10.36

6.2

6.2

6.2

6.2

5.3

3MDC04-113-xx

3MDC04-113-03

103

2.2

1.5

8.2

4.6

102

2.6

1.5

9.1

5.12

7.4

7.4

7.4

7.4

3.1

3MDC04-113-05

106

1.4

1.0

8.4

7.50

100

1.7

1.0

9.3

8.37

7.4

7.4

7.4

7.4

3.8

3MDC04-113-08

107

0.9

0.6

8.4

11.85

95

1.1

0.6

9.4

13.24

7.4

7.4

7.4

7.4

4.7

3MDC04-113-10

107

0.7

0.5

8.5

14.75

91

0.9

0.5

9.6

16.49

7.4

7.4

7.4

7.4

5.3

3MDC04-113-12

107

0.6

0.4

8.5

17.65

87

0.7

0.4

9.7

19.73

7.4

7.4

7.4

7.4

5.9

3MDC04-113-15

106

0.5

0.3

8.6

22.00

82

0.6

0.4

9.8

24.60

7.4

7.4

7.4

7.4

6.8

3MDC04-113-xxAN (AlN ceramics)

3MDC04-113-03AN

105

2.3

1.6

8.3

4.60

104

2.7

1.6

9.2

5.12

7.4

7.4

7.4

7.4

3.1

3MDC04-113-05AN

108

1.4

1.0

8.4

7.50

102

1.7

1.0

9.4

8.37

7.4

7.4

7.4

7.4

3.8

3MDC04-113-08AN

108

0.9

0.6

8.5

11.85

96

1.1

0.6

9.5

13.24

7.4

7.4

7.4

7.4

4.7

3MDC04-113-10AN

108

0.7

0.5

8.5

14.75

92

0.9

0.5

9.5

16.49

7.4

7.4

7.4

7.4

5.3

3MDC04-113-12AN

107

0.6

0.4

8.5

17.65

88

0.7

0.4

9.6

19.73

7.4

7.4

7.4

7.4

5.9

3MDC04-113-15AN

106

0.5

0.3

8.5

22.00

83

0.6

0.4

9.7

24.60

7.4

7.4

7.4

7.4

6.8

3MDC04-155-xx

3MDC04-155-03

102

3.2

1.5

11.0

6.31

102

3.7

1.5

12.2

7.02

8.6

8.6

8.6

8.6

3.1

3MDC04-155-05

105

2.0

0.9

11.2

10.29

101

2.3

0.9

12.5

11.48

8.6

8.6

8.6

8.6

3.8

3MDC04-155-08

107

1.3

0.6

11.4

16.25

97

1.5

0.6

12.8

18.16

8.6

8.6

8.6

8.6

4.7

3MDC04-155-10

107

1.0

0.5

11.5

20.23

93

1.2

0.5

12.7

22.61

8.6

8.6

8.6

8.6

5.3

3MDC04-155-12

106

0.9

0.4

11.5

24.21

90

1.0

0.4

13.0

27.06

8.6

8.6

8.6

8.6

5.9

3MDC04-155-15

106

0.7

0.3

11.5

30.17

85

0.8

0.4

13.1

33.74

8.6

8.6

8.6

8.6

6.8

3MDC04-155-xxAN (AlN ceramics)

3MDC04-155-03AN

104

3.3

1.5

11.1

6.31

105

3.9

1.5

12.4

7.02

8.6

8.6

8.6

8.6

3.1

3MDC04-155-05AN

107

2.1

1.0

11.3

10.29

103

2.4

1.0

12.6

11.48

8.6

8.6

8.6

8.6

3.8

3MDC04-155-08AN

108

1.3

0.6

11.4

16.25

98

1.5

0.6

12.8

18.16

8.6

8.6

8.6

8.6

4.7

3MDC04-155-10AN

107

1.1

0.5

11.4

20.23

94

1.2

0.5

12.9

22.61

8.6

8.6

8.6

8.6

5.3

3MDC04-155-12AN

107

0.9

0.4

11.4

24.21

91

1.0

0.4

12.9

27.06

8.6

8.6

8.6

8.6

5.9

3MDC04-155-15AN

106

0.7

0.3

11.4

30.17

86

0.8

0.4

13.0

33.74

8.6

8.6

8.6

8.6

6.8


All 3MDC Thermoelectric Coolers have the "Out-of-Pyramide" concept.  Instead of classical pyramidal shape - typical for multistage thermoelectric coolers - all 3MDC TECs  have a cubic shape with the same dimensions of TEC cold and hot sides. Having the enlarged cold side 3MDC TECs provide all the benefits of 3-stage TE coolers in terms of cooling capacity and achievable temperature differences.  This is optimal for detector applications, especially for large-size detector arrays. The additional benefit of 3MDC TECs shape is in ability to create stacks - multiple TECs connected together. 3MDC04 thermoelectric coolers are assembled using RoHS compliant Sn-Sb solder  (Tmelt=230ºC) and meet Telcordia GR-486 standard requirements.  Wide range of TEC manufacturing options is available.  The standard and most common types from our 3MDC04 types are listed in the table below.  Detailed TEC drawings, 3D models, performance plots and estimations for particular application conditions are provided by request.

STANDARD 3MDC04 SERIES 3-STAGE THERMOELECTRIC COOLERS AVAILABLE

3MDC04 TE COOLERS ADVANTAGES

3MDC04 TE COOLERS KEY FEATURES

◻︎ "Out-of-Pyramide" Concept, enlarged cold side

◻ Cold Side from 6.2x6.2mm2 .. 8.6x8.6mm2

◻ Wide range of standard TEC types available

◻ Wide range of manufacturing options available

◻ High-quality bulk BiTe material

◻ Accurate steam soldering technology

◻ RoHS compliant TE Coolers by default

◻ Telcordia GR-468 qualified TECs

3MDC Stacks

Three-stage

TEC Stacks

3MDC04

Three-stage

TE Coolers