TO-3 Header

TE Cooler

TEC Contacting to Header Pins

(Soldering)

  1. A.Header Material

    Kovar


  1. B.Header Surface Finish

    Gold Plating


  1. C.TEC Mounting

  2. 1. Soldering

  3. a.Solder 138, Sn-Bi, Tmelt=138ºC

  4. b.Solder 199, Sn-Zn, Tmelt=199ºC

  5. 3. Epoxy Gluing

  1. D.TEC Leads Connections

    Soldering Sn-Sb, Tmelt=230ºC


  1. E.TEC Cold Side Finish

  2. 1.Blank Ceramics

  3. 2.Metallized Ceramics

  4. a.Ni/Sn plating

  5. b.Au plating

  6. 3.Metallized and Pre-tinned

  7. a.Solder 117, In-Sn, Tmelt=117ºC

  8. b.Solder 138, Sn-Bi, Tmelt=138ºC

  1. F.Thermistor (Optional)

    RMT’s TB type NTC thermistor

  1. 1.10kOhm@20C, 5%

  2. 2.2.2kOhm@20C, 5%


    Individual calibration available

   

    Mounting by Epoxy Gluing

TO-3 8pin

Thermistor

TEC to Header

Mounting (Soldering)

Thermistor to Header Pins Mounting (Soldering)

TO-3 6pin

Dimensions are in millimeters

Click here to explore all available sub-mounts with detailed datasheets

Back to Sub-Mounts SelectionTE_Sub-Mounts.html

TO-3 Header is suitable in applications where quite powerful TECs are required. It’s open surface provides a possibility to install various single- and multi-stage TECs types. Mostly requested single-stage solutions with powerful low pellet height TECs. Header version with 8 pins is standard. 6pins TO-3 is requested in some specific applications with elongated TEC shape.

Standard TE Cooling Solutions availablehttp://www.rmtltd.ru/sm_to3.htm

© TEC Microsystems GmbH 2008

TO-3 8pin Flat

  1. ‣The diamond-like package is often used in laser applications.

  2. ‣The base material is CRS (cold rolled steel) .

  3. ‣Gold plating as usual.

  4. ‣The number of pins is up to 8 (usually 8 or 8).

  5. ‣The surface open for TEC mounting is 8 x 8 or 8 x 12 mm2.

  6. ‣Solutions with powerful single-stage and multistage TE modules available.