TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies




Performance @50ºC, Dry N2 

Cold Side

Height

PDF

ASM TYPE

dTmax

Qmax

Imax

Umax

ACR

A

B

H



K

W

A

V

Ohm

mm

mm

mm

TO4606.1MD02004xx

TO4606.1MD02004xx Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0200403ANt

69

0.19

0.6

0.5

0.7

1.0

1.0

0.7

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200403

68

0.18

0.6

0.5

0.7

1.0

1.0

0.9

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200404ANt

72

0.15

0.4

0.5

0.9

1.0

1.0

0.8

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200404

70

0.14

0.4

0.5

0.9

1.0

1.0

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD02008xx

TO4606.1MD02008xx Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0200803ANt

68

0.35

0.5

1.0

1.4

1.2

1.2

0.7

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200803

67

0.33

0.5

1.0

1.4

1.2

1.2

0.9

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200804

70

0.27

0.4

1.0

1.8

1.2

1.2

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0200805

72

0.22

0.3

1.1

2.2

1.2

1.2

1.1

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD02012/1xx

TO4606.1MD02012xx_1 Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0201203/1ANt

66

0.50

0.5

1.5

2.0

1.2

1.9

0.7

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0201203/1

65

0.47

0.5

1.5

2.0

1.2

1.9

0.9

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0201204/1

68

0.38

0.4

1.5

2.7

1.2

1.9

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0201205/1

70

0.32

0.3

1.6

3.4

1.2

1.9

1.1

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD03002xx

TO4606.1MD03002xx Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0300204ANt

72

0.16

1.0

0.3

0.2

1.0

1.0

0.8

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300204

70

0.16

1.0

0.3

0.2

1.0

1.0

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300205

71

0.13

0.8

0.3

0.3

1.0

1.0

1.1

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300208

72

0.09

0.5

0.3

0.4

1.0

1.0

1.4

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD03004/1xx

TO4606.1MD03004xx_1 Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0300404/1ANt

71

0.32

1.0

0.5

0.4

1.2

1.9

0.8

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300404/1

70

0.30

0.9

0.5

0.4

1.2

1.9

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300405/1

71

0.25

0.8

0.5

0.5

1.2

1.9

1.1

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0300408/1

72

0.17

0.5

0.5

0.8

1.2

1.9

1.4

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD04003/1xx

TO4606.1MD04003xx_1 Thermoelectric Sub-Assembly (Thermoelectric Cooler on TO-46 6pin header

TO4606.1MD0400303/1ANt

67

0.49

2.0

0.4

0.1

1.2

1.9

0.7

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0400303/1

66

0.46

2.0

0.4

0.1

1.2

1.9

0.9

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0400305/1

71

0.32

1.3

0.4

0.2

1.2

1.9

1.0

Thermoelectric sub-assembly detailed datasheet request

TO4606.1MD0400308/1

73

0.22

0.9

0.4

0.3

1.2

1.9

1.1

Thermoelectric sub-assembly detailed datasheet request


The TO-46 header is one of the smallest TO-style headers for thermoelectric coolers (TECs) integrating.  Thermoelectric coolers on TO-46 are widely used in VCSEL and similar low-power semiconductor LD active cooling applications, as well as in some types of optical sensors.  Despite the very small space for TEC mounting (~1.2x2.3mm2), the number of thermoelectric coolers compatible with TO-46 in TEC Microsystems' standard product line is over three dozen.


TEC Microsystems uses TO-46 headers with 5 or 6pins, which is usually enough to for thermoelectric cooler, temperature sensor and LD chip. TO-46 headers have Au plating suitable for wire bonding (WB).

Two orientations of the TEC relative to the header pins are available.  The thermoelectric cooler itself can be mounted on TO-46 header with WB pads for further bonding or connected to the header pins (by wire or solder drop).  TEC is mounted on TO-46 by soldering (Sn-Ag-In, Tmelt=206ºC), thanks to this TO-46 based sub-assembly can withstand short term heat up to 200ºC in subsequent assembly steps.  

The most common and typical TEC solutions with TO-46 based headers are shown in the table below.  The total number of available thermoelectric cooler configurations is much higher.

TO-46 TE Sub-Assemblies Advantages

Integrated TE Cooler Features

◻︎ Industry standard TO-46 6pin Header

◻ Integrated TEC Cold Side up to 1.2x1.9mm2

◻ TEC to Header mounting by soldering

◻ 100% QC and TEC testing "before and after"

◻ Short time processing with up to 200ºC

◻ Wide range of standard TEC types available

◻ Customization and manufacturing options

◻ High-quality bulk BiTe material

◻ High-density pellets placement (HD)

◻ Accurate steam soldering technology

◻ Al2O3 or AlN ceramics

◻ WB and Wired configurations

◻ RoHS compliant TE Coolers by default

◻ Telcordia GR-468 qualified TECs

thermoelectric coolers on TO-46 headers

Send Request

for addional informaiton

Standard Solutions

dimensions and performance

TO-46 6pin

with  

TE Coolers

TO-46 5pin

with

TE Coolers

STANDARD  CONFIGURATIONS  (TECs on TO-46 6pin HEAD
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