RoHS

TEC Microsystems GmbH confirms that it only uses qualified component manufacturers in all products, whose specifications meet or exceed the requirements of the European Directive for the Restriction of use of certain Hazardous Substances (RoHS) that were introduced in July 2006, and also include the recast requirements laid down in Directive 2015/863/EC (the EU RoHS 3 directive).

TEC Microsystems GmbH hereby certifies that its products do not contain any of the following banned substances, in quantities which would exceed those specified limits:

◻︎ Lead (Pb) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Mercury (Hg) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Cadmium (Cd) - Limit: 0.01% of component weight = < 100ppm

◻︎ Hexavalent Chromium (Cr6+) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Polybrominated Biphenyls (PBBs) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Polybrominated Diphenyl Ethers (PBDEs) - Limit: 0.10% of component weight = <1000ppm

Every product batch is marked with an internationally recognised RoHS compliancy label, in a prominent position on the products specifications and packaging.

It is the intention of TEC Microsystems GmbH to deal only with suppliers that can demonstrate they can manufacture  products, components or materials in an environmentally responsible manner, that meet the requirements of the RoHS Directive 2015/863/EC.

REACH

TEC Microsystems GmbH fully supports the aim of REACH in improving the protection of human health and the environment through the better and earlier identification of the intrinsic properties of chemical substances. TEC Microsystems products are non-chemical products that are not designed to release any substance under normal and reasonably predictable application scenarios during their lifespan. Therefore, as per REACH requirements, TEC Microsystems GmbH products do not need to be registered.

Based on information obtained from our suppliers, this document certifies that NO TEC Microsystems products contain > 0.1% by weight of the Substances of the Very High Concern (SVHC) as listed by the European Chemical Agency (ECHA) under the provisions of Regulation No. 1907/2006 including the new candidate list that was released on 21 Jan 2025 (247 substances).

MATERIALS USED FOR THERMOELECTRIC COOLERS MANUFACTURING

Thermoelectric cooler construction is technically pretty simple.  The detailed review is available in our FAQ. Typical thermoelectric cooler, manufactured by bulk technology, consists of ceramics plates with metallization, Bi-Te pellets, terminal wires and assembly solder.  TEC ceramics in most cases is Al2O3 or AlN (or both together in some solutions).  Each Bi-Te pellet pair inside TEC has P- and N- type with slightly different material composition.  Terminal wires in most cases are from Copper, sometimes from Nickel.  TEC internal assembly solder is Sn-Sb Solder 230 (Tmelt=230ºC) by default.  

TEC Microsystems GmbH can provide RoHS and REACH certificate with a detailed material composition for every TE cooler in the manufacturing range.  Below is the example of material composition for 1MC06-142-05 thermoelectric cooler - our standard type from 1MC06 Series.  

All the materials used for our thermoelectric coolers manufacturing are RoHS compliant and fullfil REACH requirements.  All thermoelectric coolers provided by TEC Microsystems are RoHS compliant by default.

Email:     info(at)tec-microsystems.com

Phone:     +49 (030) 6789 3314

Fax:          +49 (030) 6789 3315