MIN required TEC Cold Side dimensions A x B.
Space to place your object on TEC.
MAX acceptable TEC Hot Side dimensions C x D. Space available to fit TEC in a package.
MAX acceptable TEC Height, H. Critical, if you seal TEC in a package with cap.
TEC Hot Side (bottom) temperature. We consider that TEC hot side is stabilized at ambient temperature.
Required TEC Cold Side (top) temperature
Ambience (application environmental conditions)
Heatload Q created by object on TEC cold side
Max possible electrical current in operating mode
Max possible electrical voltage in operating mode
The required TEC terminal connection method
TEC Microsystems GmbH has more than 5000 different thermoelectric coolers in the product range. To suggest the optimal thermoelectric cooler (TEC) for your application, we need to understand your applicational conditions, requirements, and limitations adequately. There is nothing complicated here. We need to check a few general application requirements. Then we can suggest the most optimal thermoelectric cooler from our range.
TEC QUICK REQUEST CONTACT FORM
TEC APPLICATION TERMS AND DEFINITIONS
Please, fill out the form below and send it. We will be glad to assist you with the optimal thermoelectric cooler choice. If all the parameters are known and described correctly, searching for the optimal thermoelectric cooler does not take long, and you will get an answer quickly.